Cellecta HiDECK 18 Board

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Description

Cellecta HiDECK 18 Board

HiDECK 18 increases the efficiency of an underfloor heating boards system due to its low thermal resistance and rapid heat transfer characteristics. HiDECK 18 offers a range of benefits including no need for screws thanks to the tongue and groove design. Other benefits include:

 - Very low thermal resistance (0.045m /kW)
 - High thermal conductivity (0.40W/mK)
 - Low thermal expansion
 - Only 18mm thick
 - Doesn't contract or expand like chipboard when exposed to water
 - High impact resistance
 - Quick and easy to install
 - Accepts ceramic tiles


Technical Specifications

Thickness18mm
Board size
600mm x 1200mm
Weight per board
15.55kg
Weight per m2
21.60kg
Edge profile
Tongue & groove
Thermal resistance
0.045 m2/kW



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