Cellecta HiDECK 18 Board

Description

Cellecta HiDECK 18 Board

HiDECK 18 increases the efficiency of an underfloor heating board system due to its low thermal resistance and rapid heat transfer characteristics. HiDECK 18 offers a range of benefits including no need for screws thanks to the tongue and groove design. Other benefits include:

 - Very low thermal resistance (0.045m /kW)
 - High thermal conductivity (0.40W/mK)
 - Low thermal expansion
 - Only 18mm thick
 - Doesn't contract or expand like chipboard when exposed to water
 - High impact resistance
 - Quick and easy to install
 - Accepts ceramic tiles

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